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FAQs about Assembly Methods

FAQs about Assembly Methods

FAQs about press-fit technology

  • No thermal stress on the circuit board and thus less risk of corrosion
  • Significantly lower contact resistance and thus higher current carrying capacity due to cold solder joints
  • No risk of cold solder joints
  • Good adhesion of coatings, as no flux residues are left behind
  • High mechanical strength and vibration resistance

In general, press-in forces of 60 up to 250 N per pin can be expected. This can vary depending on the Powerelement, the hardness of the PCB, the surface finish and the quality of the hole in the PCB.


Yes, deviations can be detected by the press-fit forces, as press-fit forces are an important indicator for a properly performed press-fit connection. We recommend the use of a force-displacement measurement.


Generally between 60 % and 80 % of the press-in force.


Since we introduced this technology nearly 40 years ago, the specifications are based on our internal qualifications. The guideline value is 60 to 250 N per pin, multiplied by the number of pins of the Powerelements. Pull-out forces are 60 to 80 percent of the press-in forces.


We recommend a minimum distance of approx. 4 mm to other components. Between two Powerelements we recommend a distance of about 10 mm. For best performance, there must be sufficient copper around the Powerelements. The distance must also be matched to the press-fit tool so that only the desired Powerelements are touched during the press-fit process.


General information can be found in the product section for each Powerelement. The hole pattern specification is shown on the product drawing and can be requested from us at any time.


During the press-fit process with massive pins, the deformation occurs in the PCB. This displaces the base material/resin of the PCB and the copper layer in the hole. If the thickness of the copper layer is too great, unwanted material throw-up can occur.


Yes, the technology is qualified for HAL. After the switch to lead-free HAL in 2005, HAL has generally became less important. The most commonly used surface for this assembly method is chemical tin.


The press-in tools are available from us. For in-house production, we can provide the necessary information.


We recommend the use of a placement aid in the form of a template. This allows the component to be placed quickly and safely. It also ensures that the PCB or other components are not damaged. When using CNC controlled placement machines, a camera system can be used to detect the position of the hole pattern in the PCB to accurately feed the component.


No special tools are required to press in. A simple toggle press is sufficient. The PCB must be supported during the pressing process. The press force must be applied at a 90° angle the PCB. In addition, the through-hole plating of the PCB must be done according to our specifications.


We recommend a gap between the Powerelement and the PCB to ensure that excessive forces do not enter the PCB. If force-displacement measurement is used during press-fit, we recommend that the gap be selected to compensate for PCB thickness tolerances without pressing on the "block". In addition, we recommend that high current contacts be press-fitted to the point where the pin phase protrudes from the PCB for maximum current carrying capacity.

Some of our customers press on "block" and turn off the press-in process when a defined press-in force is reached.

For LF PowerPlus Powerelements, the gap must be at least 0.5 mm due to the design.


"Pressing on block" means to press-in the Powerelement until the Powerelement body contacts the PCB.


For the press-fit technology, we recommend a PCB thickness of a minimum 1.5 mm.


FAQs about Soldering

General information can be found for each Powerelement on this online platform. Solder pad and solder pad mask recommendations can be found in the product drawing and are available upon request.


Subsequent soldering of the Powerelements using the press-fit technique is not necessary. Please note that tin accumulations may occur. We are not aware of any defectscaused by the temperature process at customers using this method. However, we have not performed any qualification.


General FAQs

Yes, our Powerelements are traceable. Please provide us with the delivery bill number or the delivered batch number.


Powerelements
All products

(LF) PowerOne

Ideal for versatile & customizable applications

More about the product group

(LF) PowerTwo

Ideal for through-bolt connectors, especially for high bolt-on forces

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PowerLamella

Ideal for connections with Radsok connectors and high contact overlap of the lamella contacts

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PowerRadSok

Ideal for connections with lamella connectors and high contact overlap of the lamella contacts

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PowerFlex

Ideal for combinations of screw and Faston flat connectors in conjunction with low weight requirements

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LF PowerPlus

Ideal for increased torque requirements (from 4Nm), lower weight requirements, and automated processing operations

More about the product group

LF PowerBasket

Ideal for multiple plugging cycles with low plugging forces, high position tolerance and low weight requirements

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PowerCover

Ideal for the protection of Powerelements (rotation and contact protection)

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