Product collage of PowerOne Powerelements on dark grey background

(LF) PowerOne

(LF) PowerOne

The One and Only

Ideal for versatile & customizable applications

REACH- and RoHS-compliant one-piece (LF) PowerOne Powerelements allow you to supply  and distribute high currents to PCBs. Flexibly configurable and available in thousands of variations, they are ideal for fuses and cable connections to the PCB or as mounting elements. For PCB mounting, the range offers several options: Press-in, SMT, THT and THR.

Depending on the pin configuration and layout, currents of up to 1,000 amperes can be carried.

Product overview PowerOne Press-fit (PDF)

Product overview PowerOne SMD (PDF)

 

The lead-free version (LF PowerOne) of PowerOne Powerelements is also available:

Product overview LF PowerOne Press-fit (PDF)

Product overview LF PowerOne SMD (PDF)

Product image collage of PowerOne Press-fit and SMD Powerelements

Key information at a glance

Application possibilities

  • Contacting / fastening of switches, fuses, etc.
  • Wire-to-board for screwing ring cable lugs
  • Board-to-board
  • Electromechanics such as housing fastening and spacers

From sample to market

Samples are available even in small quantities. Individual Powerelements for series production are also no problem.
Just tell us what you need!

Packaging

Flexible packaging options: bulk, trays or in blister on reel for cost-effective assembly. In addition, you have the option to package the items in ESD blister tape, optionally with Kapton stickers or completely in your desired packaging.

Application possibilities

For mounting and fixing of switches, fuses, etc.

Application possibilities

For mounting and fixing of switches, fuses, etc.

The (LF) PowerOne Powerelements are ideal for attaching components such as fuses, switches and much more to the PCB. Learn more about these and other interconnect solutions now.

PowerOne Application Example

Processing options for (LF) PowerOne Powerelements

MPFT (Massive Press Fit Technology)

Massive press-fit technology is the process of pressing solid pins into an electrically plated-through hole in a printed circuit board. Powerelements for press-fit technology have excellent mechanical and electrical properties, making them ideal for use in harsh environments such as high temperature fluctuations or vibration. The press-fit process creates a high performance, gas-tight cold welded connection with a contact resistance of just a few μOhm. This ensures very high current carrying capacity through low resistance contact points.

PCB design 

Printed circuit boards must be designed in accordance with the latest edition of IPC A 600. In the case of solid press-fit technology, the PCBs must be designed in accordance with the Würth Elektronik ICS Press-fit Specification. Special attention should be paid to hole diameter and copper thickness.

SMT (Surface Mount Technology)

SMT is the process by which the component is soldered to the surface of the PCB. The solder paste is applied using a stencil, and unlike to the massive press-fit technology, the solder pad is electrically connected to the different layers of the PCB via vias as standard.

PCB design recommendations 

PCBs should be designed in accordance with the latest edition of IPC A 600. Footprint specifications are available. 

THR (Through Hole Reflow)

The THR process is based on the SMT process. In the THR process the pins are placed in the through-holes in the PCB, that are filled with solder paste. Similar to the SMT process, the solder paste is applied using a stencil. The paste melts in the oven and the pins are soldered into the holes.

PCB design recommendations 

Printed circuit boards should be designed in accordance with the latest edition of IPC A 600. Footprint specifications are available. 

THT (Through Hole Technology)

The THT process involves soldering solid pins into electrically plated-through holes in a printed circuit board. A distinction is made between wave soldering and selective soldering. In the former, the entire board is passed over a tin wave. In the selective soldering, the solder joints are approached individually with a tin crucible. The contact resistance of the solder joint is higher compared to the massive press-fit technology. This can affect the current carrying capacity.

PCB design recommendations 

Printed circuit boards should be designed in accordance with the latest edition of IPC A 600. Footprint specifications are available. 

Further information

Torques

Torque values for the various thread dimensions are listed on the Technology section. Different material combinations or thread lengths for bushings are not considered. Depending on the thread length, the bushings can be tightened to higher torques.

Current carrying capacity

The current carrying capacity must always be considered in the context of the overall system. Our measurements have shown that the limiting factor is usually the PCB layout or the connection of external leads (contact resistance press-in zone 100-200 μΩ).

Qualification

(LF) PowerOne Press-fit and SMD high current contacts have successfully passed the vibration and mechanical shock tests according to ISO 16750-3.
Vibration test according to ISO 16750-3:2012 4.1.2.7 Random test VII.
Mechanical shock test according to ISO 16750-3:2012 4.2.3 Severity 2.

Accessories

PowerCover anti-torsion and anti-touch elements

Accessories

PowerCover anti-torsion and anti-touch elements

The PowerCover product group offers a wide range of anti-torsion and anti-touch elements. Various designs are available as shields, some with features integrated into the Powerelements. They all have one thing in common: More safety!

PowerOne Zubehör Cover

FAQs

In general, forces of 40 to 250 N per pin can be expected. This can vary depending on the Powerelement, PCB hardness, surface and hole quality of the PCB.


Yes, all PowerOne Powerelements are also available in the lead-free "LF" versions.


Yes, our Powerelements are produced with a special date code. This allows us to track the production batches if necessary.


Product groups that match your search

  • Product image of several versions of the PowerCover Powerelements

    PowerCover

    The PowerCover anti-torsion and anti-touch elements provide a secure connection for wire-to-board connections. They fix the direction of the wire-to-board connections and provide shielding.

  • Product image of the lead-free Powerelement LF PowerPlus 2.0

    LF PowerPlus

    The lead-free LF PowerPlus Powerelements are an alternative to the (LF) PowerOne Powerelements. They are characterized by a higher torque at comparatively lower weight.

  • Product picture of PowerRadsok Powerelement

    PowerRadsok

    (LF) PowerOne Bolts are the ideal complement to PowerRadsok bushes. This combination makes it easy to create pluggable wire-to-board and board-to-board connections. 

  • Product picture of PowerBasket Powerelement

    LF PowerBasket

    Using (LF) PowerOne bolts combined with LF PowerBasket bushes allows to realize a wide range of connections. Thanks to a considerable position tolerance, even with multiple contacts.

Powerelements
All products

(LF) PowerOne

Ideal for versatile & customizable applications

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(LF) PowerTwo

Ideal for through-bolt connectors, especially for high bolt-on forces

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PowerLamella

Ideal for connections with Radsok connectors and high contact overlap of the lamella contacts

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PowerRadSok

Ideal for connections with lamella connectors and high contact overlap of the lamella contacts

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PowerFlex

Ideal for combinations of screw and Faston flat connectors in conjunction with low weight requirements

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LF PowerPlus

Ideal for increased torque requirements (from 4Nm), lower weight requirements, and automated processing operations

More about the product group

LF PowerBasket

Ideal for multiple plugging cycles with low plugging forces, high position tolerance and low weight requirements

More about the product group

PowerCover

Ideal for the protection of Powerelements (rotation and contact protection)

More about the product group