Application possibilities
For wire-to-board, board-to-board connections and for contacting switches, fuses, etc.
Application possibilities
For wire-to-board, board-to-board connections and for contacting switches, fuses, etc.
LF PowerBasket Powerelements are ideal for wire-to-board and board-to-board connections, as well as for attaching components such as fuses or switches to the PCB. Learn more about these and other interconnect solutions now.
Processing LF PowerBasket Press-fit
The LF PowerBasket Press-fit Powerelements are pressed into the PCB, no soldering is required. Therefore, the PCBs are not exposed to any temperature stress. The manufacturing step fits easily into the process chain and is extremely cost effective. For LF PowerBasket Powerelements with housing, the housing serves to protect the contact system during the press-fit and mating process.
Processing instructions:
- No special equipment is required for press-fitting during prototyping; a simple toggle press is sufficient.
- The PCB must be supported during the press-fit process.
- The press force must be applied at a 90° angle to the PCB.
- Through-hole plating of the PCBs must be performed according to Würth Elektronik ICS specifications.
- Use only suitable press-fit tools.
Further information
PCBs shall be designed in accordance with the latest edition of IPC A 600. In the case of massive press-fit technology, the PCBs must be designed in accordance with the Würth Elektronik ICS Press-fit Specification. Special attention should be paid to drill diameters and copper thickness.
The current carrying capacity must always be considered in the context of the overall system. The contact resistance, depending on the PCB assembly, has an extremely low value of 100 - 350 μΩ. Our measurements have shown that the limiting factor is usually to be found in the PCB layout of the connection of external leads.
LF PowerBasket Press-fit high current contacts have successfully passed the vibration test according to the standard ISO 16750-3:2012 4.1.2.7.2 Random Test VII.